Company introduction
Major equipment
About Us Major equipment
 

SMT placement machine
----- YG12 / YG12F speed placement machine,
----- chip speed: 36000CPH / 22000CPH.

Fully Automatic solder printing machine
----- HTGD GD450 fully auto,
----- The maximum board size: 450mm x 350mm.

Reflow oven
----- Heller 1809MK3 unleaded computer heat Wind reflow.

Wave soldering
----- Nichido Seiko RD-WS350LF-PC-B3 lead-free wave soldering (PC) special machine W: 50- 350mm.

Testing equipment
------ Otek 600 Series Automated Optical Inspection.

 
 
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